German Semiconductor Equipment Company GmbH
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With the structures in chip production becoming smaller and smaller, the demands on today’s cleaning systems in terms of their performance are increasing sharply. The aim is to develop reliable systems that meet or exceed customer requirements. Due to the excellent network of contacts and the many years of cooperation with the top players in the global semiconductor industry, GSEC is able to incorporate future requirements into the development of the systems at an early stage.
There are further improvements on the GSEC road map with regard to the performance of container cleaning and the integration of measurement technology to measure the quality of the cleaning. In addition, the development of systems for EUV technology, the latest generation of exposure (Extreme Ultra Violet), with the highest requirements in terms of container cleanliness.
Fully automated AMHS integrated system for FOUP purification to exceed the highest industry requirements. Separation of the FOUP shell and lid surfaces to avoid cross contamination and reduce the consumption.
Fully automated on demand RSP purification system. Separation of the surfaces which must be cleaned. Highest Throughput with small footprint attached to the AMHS for fully automated HOST driven operation.
Fully automated EUV pod cleaner for AMHS integrated HOST driven operation.
